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Seoul South Korea

Welcome to ICEMC 2020

2020 The 6th International Conference on E-business and Mobile Commerce - ICEMC 2020 will take place from May 27-29, 2020 in Seoul, South Korea. Prospective authors are invited to submit research abstracts or full papers. Papers in the fields of E-business, Mobile Commerce and related areas may also be considered. Audiences are welcome to join the conference for research and opinions exchanging. The conference will also feature a Keynote Address. International Conference on E-business and Mobile Commerce is an international platform for scholars, researchers and practitioners to discuss interdisciplinary research and practices in the fields of E-business and Mobile Commerce. It also provides an interdisciplinary platform for policymakers, top managers, researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of E-business, Mobile Commerce.

Notes: If the conference cannot be held on time due to the force majeure such as politics, weather and disasters, the organizer shall have the right to postpone or cancel the conference. Participants are required to comply with the organizer's arrangements and refund policy.

  • Submission Deadline: March 31, 2020

    Please submit your articles to the conference before the deadline. The review process may take about 2-3 weeks.

  • Notification Deadline: April. 20, 2020

    The review result will be sent to authors by email from the conference secretary. Please look out for your email.

  • Registration Deadline: May. 10, 2020

    To aviod any inconvenience for your participation,please finish your registration by the deadline.

Notification    

Due to the outbreak of the coronavirus, Online/Video Presentation are acceptable on the conference. Online presentation session will be arranged accordingly. Please contact the conference secretary for more information about Online/Video Presentation.

Participants are required to wear face mask when attending the conference. And conference staff will check the body temperature and take other active action.

 

Publication

Accepted excellent papers by ICEMC 2020 will be published by ACM, which will be archived in the ACM Digital Library, and sent to be indexed by EI Compendex and Scopus and submitted to be reviewed by Thomson Reuters Conference Proceedings Citation Index (ISI Web of Science).  

ISBN: 978-1-4503-7601-3

ICEMC 2019 | ISBN: 978-1-4503-7182-7 | ACM Digital Library | Index: EI Compendex and Scopus

ICEMC 2018 | ISBN: 978-1-4503-7182-7 | ACM Digital Library | Index: EI Compendex and Scopus

Conference News

2020-04-29. News! The keynote speech title and abstract are updated. (Click)

2020-04-28. News! Welcome Prof. Abdelsalam Sumi Helal from University of Florida, USA to join in the conference committee to be one of the keynote speakers. (Click)

2020-02-29. News! The submission deadline of ICEMC 2020 has been extended to March 31. Welcome to submit your paper. (Click)

2019-12-03. News! Welcome Prof. Edwin Cheng from Hong Kong Polytechnic University, China to deliver the keynote speech at ICEMC 2020. (Click)

2019-11-29. News! Welcome Prof. Ahlem Hajjem from University of Quebec in Montreal, Canada to serve as the program chair of ICEMC 2020. (Click)

2019-10-31. News! Welcome Prof. Kun-Huang Huarng from National Taipei University of Business, Taiwan to deliver the keynote speech at ICEMC 2020. (Click)

2019-09-06. News! Welcome Prof. Cheol Park from Korea University, South Korea to serve as the conference chair of ICEMC 2020. (Click)

2019-08-29. News! Welcome Prof. Alvaro Rocha from University of Coimbra, Portugal to serve as the program chair of ICEMC 2020. (Click)

2019-07-26. News! The conference proceedings of ICEMC 2019 have been indexed by EI Compendex and Scopus.

Contact Us

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+86-13438979298
Monday - Friday, 09:30am - 18:00pm

Our Email

Drop us a line anytime at
icemc@academic.net,
and weill get back soon.

Conference Venue

Seoul
South Korea

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